Silicon seed layers for anode-free cells, porous Si clathrate selectivity and pore control for Si anodes, and buffer pore strategies for high-Ni cathodes
This cycle highlights anode-free solid-state architectures with 5× critical current improvements via silicon seed layers on copper, alongside 3D porous electrode designs and halide electrolyte interfacial engineering. Silicon anode precision advances through AlF3 particle size control for selective porous Si clathrate II formation, pore-volume correlations for cycling consistency, and PAN binder optimization. High-Ni cathode reliability progresses via polypropylene-templated buffer pores in particle cores, multi-element LMFP doping, and controlled Al heterogeneity in doped NMC.
